3/28/2023 0 Comments Pls laser system lensEach spectral component of the beam is independently controlled and can be modulated in real time. When the platform is configured with three lasers, users can take full advantage of MultiWave Hybrid™ technology enabling up to three wavelengths – 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial beam. The ULTRA X6000 platform has a materials processing envelope of 36 x 24 in (914 x 610 mm), with support for materials with a thickness up to 12 in (305 mm).Ĭonfigure the customizable ULTRA X6000 platform with up to three laser sources consisting of two interchangeable CO 2 lasers and one fiber laser. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs. It is designed and ideally suited for precision material processing in manufacturing, research and development, academic research, and prototyping environments. The ULTRA X6000 platform offers laser material processing for the widest possible range of materials. Major features and options include multiple laser support, rapid laser beam positioning, precision material-independent autofocus, controllable laser power density, automation interface, multi-camera vision & registration, over temperature detection, and support for fire suppression. When the platform is configured with two lasers users can take advantage of MultiWave Hybrid™ technology enabling up to two of three wavelengths from 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial beam. The ULTRA R5000 platform has a materials processing envelope of 32 x 24 in (813 x 610 mm), with support for materials with a thickness up to 12 in (305 mm).Ĭonfigure the customizable ULTRA R5000 platform with up to two laser sources consisting of two interchangeable CO2 lasers or one CO2 laser and one fiber laser. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. The ULTRA R5000 platform offers laser material processing for a wide range of materials. Requires dedicated PC with Windows® 7/8/10 32/64 bit and one available USB port (2.0 or higher)ĥ00 CFM 6 in static pressure (850 m 3/hr at 1.5 kPa) Keypad and LCD display show current file name, laser power, engraving speed, PPI and run time. HPDFO™ (High Power Density Focusing Optics) MW Recommended for most 1.06 micron applications Recommended for most 10.6 and 9.3 micron applications
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